论文标题
在固体界面上高温下界面热电导的理论预测
Theoretical prediction of interfacial thermal conductance at high temperature across solid-solid interfaces
论文作者
论文摘要
现有的理论和方法用于计算固体界面的界面热电导，导致不同的值偏离了实验测量。在这封信中，我们提出了一个模型，可以在高温下估算ITC，而无需全面计算，其中两个不同的固体之间的界面可以视为无定形薄层，并且跨界面的协调数密度成为关键参数。我们的模型预测，在300K处的各个接口的ITC在狭窄范围内：10 $^{7} $ W m $^{ - 2} $ k $^{ - 1} $ \ sim $ \ sim $ \ sim $ 10 $^{9} $ w m $^{ - 2} - 2} $ k $ k $ k $ k $^{ - 1} $与实验相关的相关性。
The existed theories and methods for calculating interfacial thermal conductance of solid-solid interface lead to diverse values that deviate from experimental measurements. In this letter, We propose a model to estimate the ITC at high temperature without comprehensive calculations, where the interface between two dissimilar solids can be treated as an amorphous thin layer and the coordination number density across interface becomes a key parameter. Our model predicts that the ITCs of various interfaces at 300K are in a narrow range: 10$^{7}$W m$^{-2}$K$^{-1}$ $\sim $10$^{9}$ W m$^{-2}$ K$^{-1}$, which is in good agreement with the experimental measurement.
