论文标题

纯扩散系统中的高阶拓扑内角状态

Higher-Order Topological In-Bulk Corner State in Pure Diffusion Systems

论文作者

Liu, Zhoufei, Cao, Pei-Chao, Xu, Liujun, Xu, Guoqiang, Li, Ying, Huang, Jiping

论文摘要

与传统的拓扑绝缘子在其边界处具有拓扑状态相比,高阶拓扑绝缘子在其角落和铰链处表现出较低的无差距边界状态。利用Schrodinger方程与扩散方程之间的形式相似性,对高阶拓扑绝缘子的研究已从凝结物理学扩展到热扩散。不幸的是,温度高阶拓扑绝缘子的所有角状态都位于频带间隙内。到目前为止,嵌入在批量状态中的另一种角状态尚未在纯扩散系统中实现。在这里,我们构建了基于球形结构的高维su-schrieffer-Heeger模型,以阐明这些角状态,我们称其为“``子圆角状态'''。由于施加较大的汉密尔顿的抗赫米特式特性,我们通过理论计算,模拟和实验来研究这些拐角的热行为。间隙角状态。

Compared with conventional topological insulator that carries topological state at its boundaries, the higher-order topological insulator exhibits lower-dimensional gapless boundary states at its corners and hinges. Leveraging the form similarity between Schrodinger equation and diffusion equation, researches on higher-order topological insulators have been extended from condensed matter physics to thermal diffusion. Unfortunately, all the corner states of thermal higher-order topological insulator reside within the band gap. Another kind of corner state, which is embedded in the bulk states, has not been realized in pure diffusion systems so far. Here, we construct higher-dimensional Su-Schrieffer-Heeger models based on sphere-rod structure to elucidate these corner states, which we term ``in-bulk corner states". Due to the anti-Hermitian properties of diffusive Hamiltonian, we investigate the thermal behaviour of these corner states through theoretical calculation, simulation, and experiment. Furthermore, we study the different thermal behaviours of in-bulk corner state and in-gap corner state. Our results would open a different gate for diffusive topological states and provide a distinct application for efficient heat dissipation.

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